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6-Inch Wafer Through-Silicon Via Processing for Quantum Bit Devices

JapanTenders notice for 6-Inch Wafer Through-Silicon Via Processing for Quantum Bit Devices. The reference ID of the tender is 130353259 and it is closing on 02 Dec 2025.

Tender Details

  • Country: Japan
  • Summary: 6-Inch Wafer Through-Silicon Via Processing for Quantum Bit Devices
  • JPT Ref No: 130353259
  • Deadline: 02 Dec 2025
  • Financier: Self Financed
  • Purchaser Ownership: Government
  • Tender Value: Refer Document
  • Notice Type: Tender
  • Document Ref. No.:
  • Purchaser's Detail:
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  • Description:
  • 6-inch wafer through-silicon via processing for quantum bit devices
    Description: 6-inch wafer through-silicon via processing for quantum bit devices
    Provision of services Return to list of provision of services Procurement project name 6-inch wafer silicon through-via processing for quantum bit devices Procurement form Announcement date Bidding deadline Bid opening date Procurement department person in charge...
    Deadline: 2025-12-02
    [Disclaimer: This notice does not specify a specific deadline, so we have added 15 days from the date of posting]
  • Documents:

 Tender Notice

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6-Inch Wafer Through-Silicon Via Processing for Quantum Bit Devices - Japan Tender

The NATIONAL RESEARCH AND DEVELOPMENT AGENCY RIKEN, a Government sector organization in Japan, has announced a new tender for 6-Inch Wafer Through-Silicon Via Processing for Quantum Bit Devices. This tender is published on JapanTenders under JPT Ref No: 130353259 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-12-02.

The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.

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