300Mm Wafer Transfer Device Tender

Notice for 300Mm Wafer Transfer Device in Japan. The reference ID of the tender is 131337597 and it is closing on 17 Dec 2025.

Tender Details

Country: Japan
Summary: 300Mm Wafer Transfer Device
JPT Ref No: 131337597
Deadline: 17 Dec 2025
Financier: Self Financed
Purchaser Ownership: Government
Tender Value: Refer Document
Notice Type: Tender
Document Ref. No.:
Purchaser's Detail:
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Description:
300mm wafer transfer device Description: 300mm wafer transfer device 300mm wafer transfer equipment - AIST: Procurement information Major category Government procurement Medium category Tender announcement Subcategory Manufacturing or property purchase Target bases Tsukuba Center/Tokyo Headquarters Subject: 300mm wafer transfer equipment Posting started... Deadline: 2025-12-17 [Disclaimer: This notice does not specify a specific deadline, so we have added 15 days from the date of posting]
Documents:

Tender Notice

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300Mm Wafer Transfer Device - Japan Tender

The NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, a Government sector organization in Japan, has announced a new tender for 300Mm Wafer Transfer Device. This tender is published on JapanTenders under JPT Ref No: 131337597 and is categorized as a Tender. Interested and eligible suppliers are invited to participate by reviewing the tender documents and submitting their bids before the deadline on 2025-12-17.

The estimated tender value is Refer Document, and full details, including technical specifications and submission requirements, are provided in the official tender documents. Ensure all submissions meet the criteria outlined to be considered for evaluation.

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