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Latest Substrate Tenders in Japan 2025

JapanTenders brings you the latest and most relevant Substrate tenders in Japan, sourced directly from reliable government portals, purchaser websites, and leading procurement publications. Whether you're a supplier, contractor, or manufacturer, we ensure you stay informed about ongoing bidding opportunities without missing a beat.

Our platform is regularly updated with tenders related to Substrate and other keywords tenders. Each listing includes key details such as tender reference numbers, submission deadlines, and purchaser information helping you make informed bidding decisions quickly and confidently.

By subscribing to JapanTenders, users gain unlimited access to public procurement notices related to Substrate. Our tools also offer category-based filtering, email alerts, and quick tender downloads, making your bidding process faster and more efficient. Stay ahead of the competition and grow your business by exploring verified tenders from both government and private entities across Japan.

Wpt Substrate Type 1

JPT Ref No.:  124842096

Deadline:  04 Sep 2025

Superconducting Bonding Forming Device for Large-Diameter Substrates

JPT Ref No.:  122765538

Deadline:  30 Jul 2025

Evaluation Device for Fibrous Intermediate Substrates

JPT Ref No.:  118901113

Deadline:  23 May 2025

Evaluation Equipment for Fibrous Intermediate Substrates 1 Set

JPT Ref No.:  118790965

Deadline:  27 Jun 2025

Ultrahigh Precision Xray Mirror Substrate Type200uf, 700Sf 1 Set

JPT Ref No.:  113461881

Deadline:  14 Feb 2025

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